Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fnfte Ebene,*,Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fnfte Ebene,*,EP,Heading Level One,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(yyyy/mm/dd),2005,BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,STRICTLY CONFIDENTIAL,Click to edit Master title style,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,STRICTLY CONFIDENTIAL,Click to edit Master title style,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,BenQ,Confidential(2005/07/01),2005,BenQ Corporation,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,BenQ,Confidential(2005/07/01),2005,BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,Click to edit Master title style,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,Click to edit Master title style,Heading Level One,First line,Second line,Third line,Fourth line,Fifth line,*,Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fnfte Ebene,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,手機產(chǎn)品設(shè)計與開發(fā),明基電通,移動通,訊事業(yè)群 專案管理部,產(chǎn)品經(jīng)理,邱珮瑜,Polly Chiu,2006/12/26,Topic,個人簡介,明基,BenQ,簡介,產(chǎn)品開發(fā)流程,手機開發(fā)功能區(qū)塊,手機系統(tǒng)演進,3G,介紹,手機功能發(fā)展趨勢,無線通信發(fā)展趨勢,個人簡介,個人簡介,2000,年畢業(yè)於中山大學物理研究所,2001.042006.03:,明基儲存事業(yè)部研發(fā)處研發(fā)部,Team Leader of Write Strategy Team/Firmware R&D,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40 x,48x)drive development,團隊發(fā)表世界第一的,4x,8x,DL,16x DVD,燒錄機,IEEE,論文發(fā)表,發(fā)表,4,篇專利,2006.032006.12:,明基移動通訊事業(yè)群專案管理部,技術(shù)產(chǎn)品經(jīng)理,-,目前負責,3.5G HSDPA feature phone project,明基,BenQ,簡介,-,享受快樂科技,數(shù)位時尚品牌,3C,數(shù)位整合國際級設(shè)計實力,1984,年成立,企業(yè)願景,:,傳達資訊生活的真善美,1996,年股票在臺灣上市,2001,年,BenQ,品牌誕生,2005,年營收,:,明基電通,:,新臺幣,1,623,億元,明基集團,:,新臺幣,3,979,億元,全球員工人數(shù),(2006/10),明基電通,:13,000+,人,明基集團,:68,000+,人,量做精品,:,量身訂做讓消費者生活,充滿樂趣的網(wǎng)絡(luò)時尚產(chǎn)品,獨特,3C,產(chǎn)品組合：將數(shù)位產(chǎn)品整合成符合未來消費者生活型態(tài)的數(shù)位中樞 一,筆記型電腦、手機、數(shù)位電視,享受快樂科技之企業(yè),化企業(yè)願景為品牌使命,1992,2002,明基集團企業(yè)願景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,Corp.,單位,:,億元,(,新臺幣,),Phase 1,1984-1991,OEM,強大的,生產(chǎn)製造能力,從製造代工到深耕技術(shù)與設(shè)計之品牌,Phase 2,1991-2001,From OEM to ODM,多元化的技術(shù)投資,“水平整合,+,專業(yè)分工”,Phase 3,2001-2006,From ODM to Branded Business,數(shù)位時尚品牌,3C,數(shù)位整合,國際級設(shè)計實力,單位,:,億元,(,新臺幣,),三大事業(yè)群,明基電通,移動通信,事業(yè)群,(MCG),數(shù)位媒體,事業(yè)群,(DMG),整合製造服務(wù),事業(yè)群,(IMS),洞悉數(shù)位市場 掌握絕對優(yōu)勢,獨特,5C,策略 強化競爭優(yōu)勢,電子商品整合趨勢贏家,Computing,資訊產(chǎn)品,個人電腦,液晶顯示器,電腦週邊,Consumer Electronics,數(shù)位媒體產(chǎn)品,數(shù)位投影機,液晶電視,個人無線影音,數(shù)位相機,車用顯示器,Mobile Communications,移動通信產(chǎn)品,行動電話,產(chǎn)品開發(fā)流程,產(chǎn)品開發(fā)流程,Proposal,構(gòu)想階段,Plan,評估規(guī)劃階段,Design,設(shè)計階段,Execute,研發(fā)執(zhí)行階段,Mass production,生產(chǎn)階段,Close,結(jié)束階段,C System,C1,Planning,Phase,C2,R&D Design,Phase,C3,Lab Pilot,Run Phase,C4,ENG Pilot,Run Phase,C5,PD Pilot,Run Phase,Mass,Production,Phase,C6,C0,Proposal,Phase,Planning-PM,Manufacture,-Factory,Design-RD,Product definition,Feasibility analysis,ID initiation,Organize Project team member,Project schedule,HW/SW design,HW/SW design lock down,HW/SW design approved,Verification of Product maturity verification,Production line set up,Verification of production line maturity/stability,Product design finalized,Mass production,DVT Phase,MVT Phase,QVT Phase,DVT:Design Verification Testing,MVT:Manufacture Verification Testing,QVT:Quality Verification Testing,LPR:Laboratory Pilot Run,EPR:Engineering Pilot Run,PPR:Production Pilot Run,MP:Mass Production,Mobile development function Introduction,Mobile development function,外觀設(shè)計,(ID),Industry Design,機構(gòu)設(shè)計,(MD),Material Design,硬體設(shè)計,(HW)Hard Ware,BB(Base Band,基頻,),RF(Radio Frequency,射頻,),Antenna(,天線,),軟體設(shè)計,(SW)Soft Ware,MMI(Man Machine Interface,人機介面,),Protocol,Driver,Functional Architecture of Mobile Today,Feature List-HW,Camera,Sony 2.0 Mega Pixel CMOS Auto Focus camera,Strobe,LED flash light,Display,AUO 2.0”AMOLED 176x220 Pixels,262K colors,Memory,NOR Flash:128Mbit,PSRAM:64Mbit,NAND:256Mbit,SDRAM:128Mbit,External Memory,T-Flash,I/O,DC Jack,10 pin I/O,Connectivity,USB1.1,Bluetooth,ID,Vol.Up/Vol.Down,2 Segment Shutter Key,Mode Switch Key,10 Pin I/O,DC Jack,Microphone,Receiver,T-Flash Card,MD:Appearance treatment description,A,鋁板陽極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,Q,噴漆,Exploded drawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14,17,16,Front case assy.,Keypad assy.,Main lens,Joystick cap,OLED module,Receiver,Keypad FPC,Main PCB assy.,DSC module,DSC FPC,DSC holder,Speaker,Vibrator,Rear case assy.,Antenna cover,Battery cover.,Battery pack.,Placement description-I,Shielding case 1-BB,Shielding case 2-BB,T-flash connector,(push-push type),Pogo pin(for ESD),Back-up battery,(Capacitor),30pin BTB Conn.,(for DSC module),Joystick,(。